CAPA advances cutting-edge microelectronics by focusing on heterogeneous 3D integration—combining circuits and components into compact, high-performance systems. This is key for innovations in AI, autonomous driving, biomedical systems, and energy-efficient electronics.

Our mission is to enable high-density, thermally optimized, and energy-efficient integration through access to state-of-the-art packaging technologies. Leveraging expertise from Leibniz University Hannover and strong industry partnerships, CAPA fosters interdisciplinary research to shape the future of microelectronics.

Emerging topics include quantum computing, photonics, and novel materials such as diamond, aluminum nitride, and glass interposers. Cross-faculty collaboration ensures both technological and scientific challenges are addressed holistically.