Infrastructure

Technical Equipment of the Institute of Micro Production Technology


Technical Equipment of the Institute of Microelectronic Systems

Mixed-Signal Circuits Group (Prof. Bernhard Wicht)

Analog design environment

  • Virtuoso Analog Design Environment (Cadence)

Analog laboratory

  • Oscilloscopes up to 4 GHz (Tektronix)
  • Network analyzer 5 Hz - 3 GHz (Keysight)
  • High-voltage SMUs 1 kV, 20 W
  • Signal generator 250 MHz (Tektronix)
  • RLC meter (Keysight)
  • Wire-Bonder (TPT HB16) (Video)
  • Tip measuring station TS2000-DP AUTOMATED TEST SYSTEM / DARKBOX / HIGH POWER (MPI) (Video)

Architectures and Systems Group (Prof. Holger Blume)

Platforms for emulating complex hardware designs

  • BEE4, Chip-IT

Platforms for the analysis of GPGPU-accelerated data processing (CUDA, OpenCL)

Hardware design environments

  • Xilinx ISE, Altera Quartus, Synopsys Front End and Verification Tools, Cadence SoC
  • Encounter, Tensilica Xtensa Xplorer (ASIP design environment)

Fully equipped electronics laboratory

  • Logic analyzers, spectrum analyzer, audio analyzer
  • SMD soldering station
  • Assembly line
  • PXI system (National Instruments)

Test vehicle for highly automated driving

  • PANDA (photo)

3D video equipment

Picture of PANDA autonomous driving platform Picture of PANDA autonomous driving platform Picture of PANDA autonomous driving platform © Quelle: LUH

Technical Equipment of the Institute of Transport and Automation Technology

Wirebonder - Delvotec 5310/5330

  • Gold Ball-Wedge-Bonding
  • Aluminum Wedge-Wedge Bonding

Semi-automatic Wirebonder - fs-Bondtec 5310/5330

  • Gold Ball-Wedge-Bonding
  • Aluminum Wedge-Wedge Bonding
  • Camera-alignment and full automatic program mode

Manual Fineplacer – Finetech

  • Bare-Die or packaged placement and assembly system
  • Tools for various component sizes
  • Time-pressure dispensing for adhesives
  • Coaxial camera alignment of components

Rework Station – Ersa HR600/2

  • Assembly and disassembly of PCB-mounted components

Printing machine – Schläfli Challenger 173

  • Rotative single printing unit machine
  • Flexography and gravure printing available
  • Hönle mercury vapour UV-curing

Printing machine – Schläfli Challenger 650

  • Rotative multiple printing unit machine
  • Fully automatic printing sequences
  • Flexography and gravure printing available
  • Cold lamination
  • Slot-Die coating
  • GEW mercury vapour UV-curing

Coating System Erichsen - Coatmaster 510

  • Doctor-blading of liquids on various substrates

3D-Laser Marking – Keyence ML-Z9600 & Keyence MD-X2500

  • Galvo-scanner based laser systems with 3-axis
  • Marking, ablating and laser-sintering of 3D-surfaces

Lasercutter – Epilog Fusion

  • Large scale substrate processing with CO2 and Fibre laser

Contact angle measurement system – OEG surftens

  • Camera based measurement of surface energy of substrates and surface tension of liquids

 

 

 

 

Desktop-SEM – Hitachi FlexSEM

  • Compact SEM for samples with diameter < 80mm

Optical attenuation measurement system – Thalheim Spezial Optics

  • Hexapod-based alignment of samples
  • Coaxial in- and output camera systems
  • NA-measurement
  • Beamprofiling
  • Referenced attenuation of 639nm transmission with NA and diameter beam shaping

Rheometer – Anton Paar MCR302

  • Viscosity measurement over temperature and shear rate variation

Bit Error Rate Testing System – BERT

  • 500 Mbit/s – 4 Gbit/s optical BERT measurement of waveguides
  • Self built, components: Frequency Generator, PRBS Generator, Bias Tees, fibre-coupled LD and PD at 850nm, Amplifiers, Attenuators and DSA Sampling Scope

Various microscopes and other analysis equipment